FREMONT, CA -- (Marketwire) -- 07/16/12 -- Mattson Technology, Inc. (NASDAQ: MTSN), a leading supplier of advanced process equipment used to manufacture semiconductors, today introduced Helios XL, its latest rapid thermal processing (RTP) system designed to help customers achieve high transistor performance and improved device yields at the lowest cost of ownership (CoO) for advanced logic manufacturing. Featuring differential thermal energy control (DTEC), this newest addition joins the company's production-proven Helios and Helios XP family to provide a cost-effective rapid thermal annealing (RTA) solution for advanced thermal applications down through the 14 nanometer (nm) technology node and beyond.
"The introduction of Helios XL reinforces Mattson Technology's commitment to deliver high-performance, technology and productivity systems to our customers," said Johannes Keppler, business leader of Mattson Technology's Thermal Products Group. "Helios XL features the DTEC heating scheme that successfully addresses pattern loading effects for leading-edge chip structures and enables our customers to overcome technological challenges without sacrificing reliability or productivity."
About Helios XL
The Helios XL's modular platform utilizes an advanced lamp-based heating scheme designed to meet next-generation RTP requirements with better in-die uniformity and an overall improved across-wafer temperature performance. The unique DTEC solution enables different heating ratios between top and bottom lamps for pattern-loading-free wafer bulk heating along with active compensation of front-side heat loss. Helios XL provides customers the capability to run recipes at high ramp-up rates, resulting in better device results and overall shorter recipe times. This unique process capability allows customers to qualify different recipe structures and temperature profiles using the new heating scheme. The system features an optimized EFEM design that uses the latest wafer handling equipment for increased throughput, reduced particle performance and enhanced handling reliability.
About Mattson Technology, Inc.
Mattson Technology, Inc. designs, manufactures and markets semiconductor wafer processing equipment used in the fabrication of integrated circuits. The company is a leading supplier of plasma and rapid thermal processing equipment to the global semiconductor industry, and operates in three primary product sectors: dry strip, rapid thermal processing (RTP) and etch. Through manufacturing and design innovation, Mattson Technology produces technologically advanced systems that provide productive and cost-effective solutions for customers fabricating current- and next-generation semiconductor devices. The company serves foundries, and memory and logic integrated device manufacturers in the United States, Europe, China, Japan, Korea, Singapore, Taiwan and other Asian countries. For more information, please contact Mattson Technology, Inc., 47131 Bayside Parkway, Fremont, CA, 94538. Telephone: +1-800-MATTSON/+1-510-657-5900. Internet: www.mattson.com.
"Safe Harbor" Statement Under the Private Securities Litigation Reform Act of 1995: This news release contains forward-looking statements. All statements other than statements of historical fact are statements that could be deemed forward-looking statements, including but not limited to statements of the plans, strategies and objectives of management for future operations. Forward-looking statements address matters that are subject to a number of risks and uncertainties that can cause actual results to differ materially from those expressed or implied by such forward-looking statements and assumptions. Such risks and uncertainties include, but are not limited to: macroeconomic and geopolitical trends and events; end-user demand for semiconductors; customer demand for semiconductor manufacturing equipment; the timing of significant customer orders for the Company's products; customer acceptance of delivered products and the Company's ability to collect amounts due upon shipment and upon acceptance; the Company's ability to timely manufacture, deliver and support ordered products; the Company's ability to bring new products to market and to gain market share with such products; customer rate of adoption of new technologies; risks inherent in the development of complex technology; the timing and competitiveness of new product releases by the Company's competitors; the Company's ability to align its cost structure with market conditions; and other risks and uncertainties described in the Company's Forms 10-K, 10-Q and other filings with the Securities and Exchange Commission. The Company assumes no obligation to update the information provided in this news release.